Introduction
The Army Manufacturing Technology (ManTech) Program’s mission is to provide affordable and timely manufacturing solutions that address the highest priority needs of the Army. The Army ManTech Program supports transition of manufacturing technologies to systems that provide capability to the Soldier. The program accomplishes this through demonstration of effective,efficient and adaptable processes and encourages strong internal and external partnerships.
Organization
The Deputy Assistant Secretary of the Army for Research and Technology (DASA R&T) has overall responsibility for the Army ManTech Program. Within this office, system domain directors provide oversight and
coordination of ManTech consistent with Science and Technology (S&T) domain areas.
The U.S. Army Research, Development and Engineering Command (RDECOM), a subordinate command of
the Army Materiel Command (AMC), has been further designated as the Army’s ManTech Program Manager.
The Programs and Engineering (P&E) office within RDECOM performs this function and provides direction
to the Army’s Research, Development and Engineering Centers (RDECs) and the Army Research Laboratory
(ARL). ManTech managers in these organizations are responsible for coordination with project managers
for the execution of individual projects. This structure allows the Army to take advantage of system level
technical expertise by maintaining close contact with both the acquisition managers and the corresponding
technology managers. This approach ensures a balanced portfolio aligned with RDECOM Strategic Plan and
application of systems engineering during projects to promote effective project planning and execution.
Army ManTech Investment Areas
The Army ManTech Program is currently funded at approximately $60 million per year, displaying a relatively stable level of investment. Investments result in cost avoidance and reduced risk of transitioning military-unique manufacturing processes into production.
The Army ManTech process is structured to fund projects that are deemed high priority for the Army. Proposals are submitted through the laboratories and RDECs to RDECOM. ManTech efforts are vetted and prioritized through the ManTech Working Group. The ManTech efforts are reviewed by the Joint Defense ManTech Panel (JDMTP) and coordinated in concert with Technology Focus Teams (TFTs) and System Integration Domains (SIDs). Projects are approved by the RDECOM Board of Directors.
The Program supports process prototyping and pilot demonstration to develop or modify manufacturing technologies for the Army’s use. The Army ManTech Program does not acquire off-the-shelf capital equipment unless it is a minor portion of the investment and is required to establish the first-case application integral to the ManTech project. Prior to receiving Army ManTech funds, the Program Manager (PM) or organization responsible for transition and implementation must demonstrate a robust Acquisition Strategy that includes a realistic plan to transition and implement the technology in the industrial base. In support of this requirement, the PM must provide a Metrics Confirmation Memo (MCM) to validate project deliverables and alignment with acquisition milestones. The MCM provides the three key elements for transition planning (project deliverables, associated metrics that determine success of those deliverables, and a schedule that shows the planned transition point). The MCM assists with transition planning, feeds into Technology Transition Agreements (TTA’s), and facilitates implementation planning.
Specific initiatives are organized by the following domains:
― AIR SYSTEMS - to include investing in rotary wing and unmanned air vehicle ManTech efforts,
embedded sensors for composite structures
― GROUND SYSTEMS AND PRECISION MUNITIONS - to include affordable lightweight structural armor,
transparent armor solutions, multi-purpose warheads, seeker domes for missiles, and insensitive
munitions processes
― COMMAND, CONTROL AND COMMUNICATIONS SYSTEMS - to include infrared (IR) sensors and focal plane
array (FPA) systems, low cost laser designator modules, chip scale atomic clocks, flexible electronics and
micro-displays
― SOLDIER SYSTEMS - to include improved chemical heating, energy efficient shelters, chemical and
biological resistant fabric, and body armor
― ADVANCED MANUFACTURING INITIATIVES - to address “above the shop floor” technologies to include
network centric model based enterprise data to support integrated weapons system life-cycle.
The Army conducts semi-annual Internal Program Reviews (IPRs) for cost, schedule, program metrics
and implementation planning. Each project’s transition plan is routinely evaluated to see if projected
metrics and transition milestones have been met. These IPRs and other supporting program documentation
feed directly into the Army ManTech budget item justifications and success stories.
Joint Defense Manufacturing Technology Panel (JDMTP)
The Army actively participates in the Department of Defense (DoD) Joint Defense Manufacturing
Technology Panel (JDMTP) to coordinate ManTech efforts and maximize leveraged funding across the
Services, and the Defense Logistics Agency (DLA).
The JDMTP is composed of managers from the Army, Navy, Air Force and DLA ManTech Programs.
This panel also includes an ex-offi cio representative from the Office of the Secretary of Defense
(OSD).
The JDMTP defi nes a taxonomy under which DoD components coordinate technical projects to
optimize the investment of funds for manufacturing process development. To meet its challenges,
the JDMTP is structured around four technical subpanels to support the planning, execution, and
implementation of both joint and Service-unique projects. Brief descriptions of the subpanels are
included below:
― METALS PROCESSING AND FABRICATION SUBPANEL – provides manufacturing technology to develop
affordable, robust processes and capabilities for evolutionary metals and special materials, joining and
inspection.
― COMPOSITES PROCESSING AND FABRICATION SUBPANEL – coordinates manufacturing technology
projects that improve the processes used to produce composite structures in aircraft, ground vehicles,
ships, and Soldier protective systems.
― ELECTRONICS PROCESSING AND FABRICATION SUBPANEL – addresses manufacturing technology for
electronic materials, devices, integrated circuits, subassemblies, and subsystems, including digital electronics,
analog microwave and millimeter wave electronics, and photonic and electro-optics technologies.
― ADVANCED MANUFACTURING ENTERPRISE (AME) SUBPANEL – encompasses the practices and procedures
that foster collaborative and effective manufacturing enterprises including model based and
network centric manufacturing environments, modeling and simulation capabilities, adaptive supply
chains, and leveraged commercial practices.
Information for Army ManTech Points of Contact to the JDMTP subpanels, contact the Webmaster.
