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Wide Band Gallium Nitride (GaN) Monolithic Millimeter Wave Integrated Circuit (MMIC) Producibility

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Mature the W-Band GaN MMIC manufacturing process to a production relevant environment to demonstrate pilot line capability for the non lethal weapons program Solid State Active Denial Technology (SS-ADT_) to repel personnel targets. This project will demonstrate high yields and reduce cost while maintaining reliability for W-band GaN MMICs. Fabrication of these GaN chips is the largest cost driver of the ADT system. SS-ADT is suitable for crowd control with the ability to stop, deter and turn back an advancing adversary, providing an alternative to lethal force.


• Baseline current process and create a yield pareto analysis that will breakdown the process into individual steps and identify GaN MMIC yield drivers
• Conduct Design of Experiments (DOE) to improve manufacturability
• Optimize key process steps increase yield and lower Unit Cost
• Establish an automated Die Visual inspection process


• Builds upon previous ManTech effort, W-Band Solid State Manufacturing Improvements
• Addresses affordability, fabrication cycle time, and yield rate
• The GaN MMIC's will be incorporated into the Solid State Active Denial Technology (SS-ADT) "Skid Plate" demonstrator program to enhance base protection and mounted vehicle applications to repel human targets


• Increase yield of GaN MMIC's by 155%
• Reduced GaN MMIC unit production cost by 75%
• Automated visual die inspection process
• Improved robustness and reliability of GaN MMIC's

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